Small DIP Package
Small DIP Package
Low power Wi-Fi module will provide a wireless interface to any equipments with a UART interface for data thansfer. And it is widely used in IOT area, such as handheld device and industry control.
|Name||HF-LPT130A >>||HF-LPT130B >>||HF-LPT120A >>||HF-LPT120 >>||HF-LPT120G >>||HF-LPT100 >>||HF-LPT100F >>|
|Key Feature||Low Power SDK Support SmartLink Config Tiny Size Lowest Price||Low Power SDK Support SmartLink Config Small Size Strong Signal Strength Lowest Price||Low Power SDK Support SmartLink Config Small Size Lowest Price||Low Power SDK Support SmartLink Config Small Size Strong Signal Strength Lowest Price||Low Power SDK Support SmartLink Config Small Size||Low Power SDK Support SmartLink Config Small Size Strong Signal Strength|
|Processor||Cortex-M4 SOC||ARM7 SOC||ARM7 SOC||ARM7 SOC||Cortex-M3 MTK||Cortex-M3 MTK|
|Temp. Range||-40℃- 125℃||-20~+85||-20~+85||-20~+85||-40~+85||-40~+85|
|Size (mm)||22×14.3×8||22x13.5x6||22x13.5x6||24mm x 19.5mm x 3mm||22x13.5x6||22x13.5x6|
|Current @No data||~25mA||~30mA||~30mA||~30mA||~12mA||~12mA|
|Current @Tx Peak||~260mA||~280mA||~280mA||~280mA||~300mA||~300mA|
|Interface-GPIO||√||√ (5)||√ (5)||√ (5)||√||√|
|AP Mode||√||√(Max 4 STA)||√(Max 4 STA)||√(Max 4 STA)||√(Max 2 STA)||√(Max 2 STA)|
|Smart Configure SmartLink V7.X APP||√||√||√||√||√||√|
|Interface-A/D||√ (2)||√ (2)|
Stable and Reliable IOT ModulesNowadays, in WiFi module industry, the current performance of the product varies greatly, how to choose a stable and reliable WiFi module has become the problem of many engineers. Hi-flying low power modules are through FCC/CE certification and it has many applications in IOT area. Besides, with long time special test, it provides solid foundation for the reliability of the module. This will also be your inevitable choice.
Serial Transparent TransmissionLow-power series has a fully transparent transmission serial port. Customers only need to configure module simply and it can be achieved data transfer between the lower machine and server. Besides, the customer can also according to their own needs, in this basis to do secondary development to achieve data transmission.
Low Power SMT PackagingThe power consumption with no data transmission can be as low as 12ma. It use SMT packaging technology and has integrated GPIO, PWM, AD conversion and other external interfaces. And it also provides the redundant GPIO pin for the customer to carry on the secondary development.
Support AP&STA ModeThe module not only supports AP or STA mode separately but supports two kinds of work mode to work normally at the same time. Module can do STA mode to connect the router, and can generate AP hot spots, allowing the terminal device to connect.
Long-distance Transmission and High through-wall PerformanceAccording to the actual needs of customers, the module has two options which is built-in PCB antenna and external IPEX interface respectively. It effectively strengthens the signal strength and penetration, for different environments have also been significantly improved ability to effectively reduce the signal dead angle!
Support Multiple TCP / UDP ConnectionsIn addition to the default embedded two SOCKETs, the software part also supports custom socket (up to 10) to connect. Users can easily configure modules to achieve point-to-point connections in LAN and WAN area by TCP or UDP duplex transmission.
Various Module Configurations
Commonly used configuration methods are serial AT commands, WEB pages and mobile APP.
Support Smartlink ConfigurationThe module has one-key smartlink function. Users can use app which is integrated with hi-flying smartlink to connect modules with routers without any physical connections.When the module is connected to the Internet, the traditional channel between the chip and the Internet is opened up.