DIP Package
DIP Package
Overview of Characteristic
- Support Wi-Fi IEEE802.11b/g/n and BLE4.2 Wireless Standards
- Based on ARM9E SOC, 120MHz CPU, 256KB RAM, 2MB Flash
- Support UART Data Communication with Wi-Fi or BLE
- Support Wi-Fi STA/AP/AP+STA Mode
- Support Wi-Fi Sniffer SmartLink V8, WeChat Airkiss 2.0 Config
- Support Wi-Fi AP SmartAPLink Config
- Support BLE SmartBLELink Config
- Support Wireless and Remote Firmware Upgrade Function
- Support Software SDK for Develop
- Support Internal PCB or External IPEX Antenna Option
- Single +3.3V Power Supply
- Size: 23.1mm x 32.8mm x 3.5mm,SMT34 package
| Name | ★HF-LPT170 >> |
|---|---|
| Image |
|
| Wireless Standard | 802.11b/g/n BLE 5.0 |
| StorageTemp. | 40℃- 125℃ |
| Production Data | 2020/Q1 |
| Processor | RISC CPU |
| Basic Frequency | 160MHz |
| Operating System | FreeRTOS |
| Temp. Range | -40℃- 85℃ |
| Internal Antenna | √ |
| I-PEX Connector | √ |
| Size (mm) | 22mm x 15.6mm x 8mm |
| Work Voltage | 2.7~3.6V |
| Current @No data | <45mA |
| Current @Tx Peak | <350mA |
| Resource-Flash | 2MB |
| Resource-RAM | 276KB |


