DIP Package
DIP Package
Overview of Characteristic
- Support Wi-Fi IEEE802.11b/g/n and BLE4.2 Wireless Standards
- Based on ARM9E SOC, 120MHz CPU, 256KB RAM, 2MB Flash
- Support UART Data Communication with Wi-Fi or BLE
- Support Wi-Fi STA/AP/AP+STA Mode
- Support Wi-Fi Sniffer SmartLink V8, WeChat Airkiss 2.0 Config
- Support Wi-Fi AP SmartAPLink Config
- Support BLE SmartBLELink Config
- Support Wireless and Remote Firmware Upgrade Function
- Support Software SDK for Develop
- Support Internal PCB or External IPEX Antenna Option
- Single +3.3V Power Supply
- Size: 23.1mm x 32.8mm x 3.5mm,SMT34 package
| Name | ★HF-LPT170 >> | HF-LPC330 >> |
|---|---|---|
| Image | 
|
|
| Wireless Standard | 802.11b/g/n BLE 5.0 | 802.11b/g/n BLE 4.2 |
| StorageTemp. | 40℃- 125℃ | |
| Production Data | 2020/Q1 | |
| Processor | RISC CPU | ARM9E SOC |
| Basic Frequency | 160MHz | 120MHz |
| Operating System | FreeRTOS | alios |
| Temp. Range | -40℃- 85℃ | -20~+85 |
| Internal Antenna | √ | √ |
| I-PEX Connector | √ | √ |
| Size (mm) | 22mm x 15.6mm x 8mm | 22mm x 15.6mm x 8mm |
| Work Voltage | 2.7~3.6V | 3.0~3.6V |
| Current @No data | <45mA | 25mA |
| Current @Tx Peak | <350mA | 260mA |
| Resource-Flash | 2MB | 2MB |
| Resource-RAM | 276KB | 256KB |
| Key Feature | Support Software SDK for Develop | |
| Package Type | DIP10 | |
| Interface-UART | 2 | |
| Interface-PWM | PWM0~PWM5 | |
| Interface-SPI | 1 | |
| Interface-GPIO | √ | |
| AP Mode | √ | |
| STA Mode | √ | |
| AP+STA Mode | √ | |
| WPS Function | √ | |
| Web Server | √ | |
| OTA Upgrade | √ | |
| Airkiss Configure | √ | |
| SDK Support | √ |